Nota : Ceci est la version 2010鈥�2011 de l鈥檃nnuaire 茅lectronique. Veuillez mettre 脿 jour l鈥檃nn茅e dans la barre d鈥檃dresse de votre navigateur pour une version plus r茅cente de cette page, ou cliquez聽ici pour consulter l'annuaire la plus r茅cente.
Vue d'ensemble
G茅nie 茅lectrique : Interconnect structures, signal integrity issues: reflection, crosstalk, noise, electromagnetic interference, Lossy transmission lines, RLGC matrix representations, wave propagation in multilayered substrates, periodically loaded lines, Floquet's theorem, power distribution network, simultaneous switching noise, packaging structures, chip interconnection technologies, substrate integrated waveguides, methods for experimental characterization of interconnects, signal integrity CAD tools.
Terms: This course is not scheduled for the 2010-2011 academic year.
Instructors: There are no professors associated with this course for the 2010-2011 academic year.
- 3-0-6
- Prerequisites: ECSE 334 and ECSE 352 or ECSE 353.